Technical Program Committee

H.S. Abdel-Aty-Zohdy, Oakland University, USA

H. Akhtar, AT&T, USA

E. Arikan, Bilkent University, Turkey

K. Ben Letaief, University of Science & Technology, Hong Kong

P. Bellavista, University of Bologna, Italy

A. Bestavros, Boston University, USA

S. Bilgen, Middle East Technical University, Turkey

R. Boutaba, University of Waterloo, Canada

U. Çaglayan, Bogaziçi University, Turkey

T. Çataltepe, AT&T, USA

E. Çayirci, Military Academy, Turkey

R. Chang, Polytechnic University, Hong Kong

A. Corradi, University of Bologna, Italy

M. Daneshmand, AT&T Labs Research, USA

A. Elmaghraby, University of Louisville, USA

R. El-Marakby, University of Windsor, Canada

K. Erciyes, Ege University, Turkey

J. Garcia-Haro, Polytech University of Cartagena , Spain

A. J. Gonzalez V., University of Tec. Federico S.ta Maria, Chile

H. Hassaneine, Queen’s University, Canada

H. Koraitim, Thales Group, France

I. Matta, Boston University, USA

A. Mehaoua, Versailles Saint-Quentin University, France

M. Merabti, John Moores University, England

H. Mueller, Siemens AG, Germany

A. Pach, AGH Cracow University, Poland

S. Papavassilliou, NJIT, USA

M. Pioro, Warsaw Tech. University, Poland

A. Pitsillides, University of Cyprus, Cyprus

R. Popescu-Zeletin, GMD Fokus, Germany

V. Prasad, Indian Institute of Science, India

J.G. Proakis, Northeastern University, USA

A. Puliafito,   Messina University, Italy

M. Reisslein, Arizona State University, USA

G. Schaefer, Tech. University of Berlin, Germany

D. Serpanos, University of Patras, Greece

R. Steinmetz, Darmstadt University of Technology, Germany

A. Tantawi, IBM, USA

S. Tohme, ENST-Paris, France

O. Tomarchio, University of Catania, Italy

V. Tsaoussidis, Northeastern University, USA

M. Ulema, Manhattan College, USA

M. Ü. Uyar, City University of New York, USA

B. Yener, Bell Labs, USA

A. Yongaçoglu, University of Ottawa, Canada

L. Wolf, Technical University  Braunschweig, Germany